ETD

• advanced packaging
• antenna in package
• d-band
• half power beamwidth
• horn antennas
• multi-antenna
• substrate integrated waveguide

This work presents the design, optimization, and integration of an H-plane sectoral horn antenna operating in the D-band using advanced PCB technology. The research investigates an endfire radiation architecture, embedding the radiating element within the structural core of the multilayer stackup to leverage its thickness and lower dielectric losses compared to buildup layers.
To mitigate the impedance mismatch at the dielectric-to-air interface, triangular metallic directors were incorporated at the aperture. These enhance impedance matching (|S_{11}| < -10 dB with a 22% fractional bandwidth) and the Front-to-Back Ratio (FTBR > 15-20 dB), while maintaining a stable gain of approximately 9 dB.
The work culminates in the synthesis of a multi-antenna system designed for full azimuthal coverage. By arranging multiple unit elements in a radial configuration, seamless coverage and high port-to-port isolation were achieved. A detailed loss analysis shows a total efficiency between 60% and 70%, underscoring that performance at sub-THz frequencies is primarily constrained by material choice.